Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS

Read original: arXiv:2404.05862 - Published 4/10/2024 by Ying-Lin Chen, Jacob Deforce, Vic De Ridder, Bappaditya Dey, Victor Blanco, Sandip Halder, Philippe Leray
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Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS

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Overview

  • Proposes a novel approach for semiconductor defect inspection using a deep learning model called SEMI-SuperYOLO-NAS
  • Designed to improve defect detection accuracy for high-numerical aperture extreme ultraviolet lithography (high-NA EUVL) systems
  • Combines a custom neural architecture search (NAS) method with a modified version of the popular YOLO object detection model

Plain English Explanation

This research paper presents a new deep learning-based approach for inspecting semiconductor wafers for defects, with a focus on improving detection accuracy for the latest high-numerical aperture extreme ultraviolet lithography (high-NA EUVL) manufacturing processes. The key idea is to develop a custom neural network architecture that builds upon the well-known YOLO object detection model, making it more efficient and effective at finding and classifying various types of semiconductor defects.

The researchers used a neural architecture search (NAS) technique to automatically design an optimized model, rather than relying on manual architecture engineering. This SEMI-SuperYOLO-NAS model is claimed to outperform existing defect inspection solutions, especially for the increasingly complex and high-resolution patterns found in advanced semiconductor nodes.

By improving defect detection, this work could help semiconductor manufacturers enhance their yield and quality control, ultimately contributing to the continued scaling and advancement of integrated circuit technology.

Technical Explanation

The paper proposes the SEMI-SuperYOLO-NAS model, which combines a custom neural architecture search (NAS) method with a modified version of the popular YOLO object detection architecture. The NAS component is used to automatically design an optimal model configuration, rather than relying on manual architectural choices.

The SEMI-SuperYOLO-NAS model is specifically tailored for semiconductor defect inspection, particularly for high-NA EUVL manufacturing processes. It extends the YOLO model by incorporating a novel module structure and search space, as well as techniques like feature pyramid networks and multi-scale training, to enhance its defect detection capabilities.

The researchers evaluate their approach on several semiconductor defect datasets, demonstrating improved performance compared to baseline YOLO and other state-of-the-art defect inspection methods. They also conduct ablation studies to analyze the contributions of different components of the SEMI-SuperYOLO-NAS architecture.

Critical Analysis

The paper presents a well-designed and thorough study, with a clear focus on addressing the challenges of semiconductor defect inspection for advanced manufacturing processes. The use of neural architecture search to optimize the model architecture is a notable strength, as it can lead to more effective solutions than manual design.

However, the paper does not provide much discussion on the computational complexity or inference speed of the SEMI-SuperYOLO-NAS model, which could be an important consideration for real-world deployment in high-volume manufacturing environments. Additionally, the paper could have delved deeper into the specific types of defects the model is effective at detecting, and how it handles rare or novel defect patterns.

Further research could explore the generalization of the SEMI-SuperYOLO-NAS approach to other imaging modalities or defect inspection tasks beyond EUVL, as well as its integration with advanced process control and decision-making systems in semiconductor fabs.

Conclusion

This research paper presents a novel deep learning-based approach, called SEMI-SuperYOLO-NAS, for semiconductor defect inspection. By combining a custom neural architecture search technique with a modified YOLO object detection model, the researchers have developed a solution that promises to improve defect detection accuracy, particularly for the complex patterns found in high-NA EUVL manufacturing processes.

The work demonstrates the potential of advanced machine learning techniques to enhance quality control and yield in the semiconductor industry, which is crucial for the continued scaling and advancement of integrated circuit technology. While the paper provides a solid technical foundation, further research is needed to fully understand the practical implications and limitations of the SEMI-SuperYOLO-NAS approach.



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Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS
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